Custom Ceramic Substrates & Thermal Plates
Direct-factory manufacturing of precision ceramic substrates in Alumina (Al₂O₃), Aluminum Nitride (AlN), and Beryllium Oxide (BeO).
Substrate Capabilities
Dimensional tolerance to ±0.003 mm, surface flatness <5 μm per 25 mm, and Ra 0.02 μm finish.
Available Substrate Materials
Select the optimal ceramic material for your thermal and electrical requirements
Alumina (Al₂O₃)
Grade: 96%, 99.5%, 99.8%
Standard substrate for thick/thin film circuits and power modules
Aluminum Nitride (AlN)
Grade: High purity
High-performance thermal management for power electronics and LED packaging
Beryllium Oxide (BeO)
Grade: Technical grade
Exceptional thermal conductivity for aerospace and RF applications
Substrate Formats & Configurations
Direct Bonded Copper (DBC) Substrates
Al₂O₃ and AlN substrates with bonded copper layers for power module assemblies
Active Metal Brazed (AMB) Substrates
Si₃N₄ ceramic substrates with active brazed copper for high-reliability power applications
LTCC / HTCC Substrates
Multi-layer co-fired ceramic substrates with embedded conductors and vias
Bare Ceramic Plates
Flat polished substrates in custom dimensions for hybrid ICs and sensor platforms
Precision Capabilities
Actual achievable tolerances depend on material, geometry, feature dimensions, and drawing requirements.
Target Applications
Power Electronics
- -IGBT module substrates
- -MOSFET thermal pads
- -Gate driver boards
- -Bus bar insulators
Semiconductor Packaging
- -LED heat spreaders
- -Laser diode submounts
- -RF/microwave packages
- -MEMS sensor platforms
Thermal Management
- -Heatsink insulators
- -Thermal interface plates
- -Phase-change material carriers
- -Cold plate substrates
Submit Your Substrate Drawing for Review
Upload your 2D blueprints or 3D CAD files. Our engineering team will perform a DFM review and provide a competitive quote within 24 hours.
Submit Drawing for 24-Hour Review