Semiconductor Ceramic Components & Custom Parts Manufacturer
Precision ceramic parts manufactured for demanding semiconductor equipment applications.
Why Are Precision Ceramic Components Used in Semiconductor Equipment?
Precision ceramic components are used in semiconductor equipment where electrical insulation, thermal stability, dimensional accuracy, and particle-sensitive environments converge. Ceramic chamber liners, wafer handling rings, and insulation blocks resist plasma erosion and chemical attack during fabrication processes. Materials like alumina (Al₂O₃) provide high hardness and dielectric strength, while aluminum nitride (AlN) offers thermal conductivity (170-190 W/m·K) for heat dissipation in thermal management applications. Silicon carbide (SiC) and silicon nitride (Si₃N₄) deliver extreme hardness and thermal shock resistance for wafer chucks, focus rings, and high-temperature fixtures. Precision machining to ±0.003 mm and Ra 0.02 μm surface finish ensures compatibility with advanced packaging and lithography equipment requirements.
Precision Ceramic Parts for Semiconductor Equipment
Korecera manufactures custom precision ceramic components for semiconductor manufacturing and process equipment. Our ceramic parts are produced according to customer drawings and specifications, meeting the stringent requirements of semiconductor fabrication environments for purity, dimensional accuracy and surface quality.
Custom Ceramic Components
Ceramic Rings
Precision ceramic rings for semiconductor process equipment.
Ceramic Tubes
Custom ceramic tubes for gas delivery and process chambers.
Ceramic Shafts
High-purity ceramic shafts for wafer handling systems.
Ceramic Nozzles
Precision nozzles for coating and deposition equipment.
Ceramic Insulators
Electrical insulation components for semiconductor tools.
Custom Ceramic Fixtures
Custom fixtures and holders per customer drawings.
Advanced Ceramic Materials
Alumina
High hardness and electrical insulation for structural components.
Aluminum Nitride
High thermal conductivity with electrical insulation properties.
Silicon Nitride
Superior thermal shock resistance for high-temperature applications.
Silicon Carbide
Extreme hardness and corrosion resistance for demanding environments.
Ceramic Components for Advanced Semiconductor Packaging
Advanced semiconductor packaging, including high-bandwidth memory (HBM), continues to increase the performance requirements of semiconductor manufacturing and packaging equipment.
Korecera focuses on custom precision ceramic components rather than semiconductor devices. We manufacture ceramic parts according to customer drawings for equipment used in advanced packaging processes.
Custom Manufacturing Based on Your Drawings
Drawing
Customer specification review
Machining
Precision CNC machining
Grinding
Fine surface finishing
Inspection
Quality verification
Precision Ceramic Components for Semiconductor Equipment
Semiconductor Equipment: Engineering Requirements & Ceramic Solutions
Mapping equipment needs to ceramic components, materials, and manufacturing considerations
| Equipment / Process Area | Component Type | Engineering Requirement | Candidate Material | Manufacturing Consideration |
|---|---|---|---|---|
| Wafer Processing Chambers | Chamber liners, Focus rings | Plasma erosion resistance, Electrical insulation | Alumina (Al₂O₃), SiC | Precision grinding, Flatness ≤ 0.002 mm |
| Wafer Handling Systems | End effectors, Lift pins, Vacuum chucks | Dimensional stability, Low particle generation | Si₃N₄, Al₂O₃ | ±0.003 mm tolerance, Ra 0.02 μm surface |
| Thermal Management | Heater plates, ESC components | Thermal conductivity, CTE match to silicon | AlN, Al₂O₃ | Thin substrate machining, Metallization-ready surfaces |
| Gas Delivery Systems | Showerheads, Gas distribution plates | Chemical inertness, Precise hole patterns | SiC, Al₂O₃ | Micro-hole drilling, Complex pattern grinding |
| Advanced Packaging | Test socket insulators, Probe card plates | High dielectric strength, Flatness for fine-pitch contact | Al₂O₃, AlN | Large-format grinding, Parallelism ≤ 0.005 mm |
Note: Korecera manufactures ceramic components according to customer drawings. Material selection depends on specific application requirements including temperature, chemical exposure, electrical isolation needs, and dimensional tolerances.
Have a Semiconductor Ceramic Component Requirement?
Send us your drawing or specification for evaluation.
Submit Your Drawing