Advanced Ceramic Materials

High-performance ceramic materials engineered for demanding industrial applications across multiple sectors

Alumina Ceramic (Al₂O₃)

High purity aluminum oxide ceramics (95% to 99.9%) with excellent mechanical strength, electrical insulation and wear resistance. Standard choice for semiconductor processing and industrial applications.

Alumina Ceramic (Al₂O₃)

Alumina Ceramic Tubes & Rods

Key Properties

Hardness: HV0.5 >= 15 GPa
Density: 3.60 - 3.90 g/cm3
Dielectric Strength: >= 15 kV/mm
Thermal Conductivity: 25 - 30 W/m.K

Applications

Semiconductor processing chambers, electrical insulators, thermocouple protection tubes, wear-resistant components

Available Shapes

Tubes, rods, plates, rings, custom shapes

Alumina Substrates & Insulators

Key Properties

Dielectric Strength: >= 15 kV/mm
Volume Resistivity: >= 10^14 Ohm.cm
Thermal Conductivity: 25 - 30 W/m.K

Applications

LED substrates, electronic packages, high-voltage insulators, circuit boards

Available Shapes

Substrates, plates, custom insulators


Zirconia Ceramic (ZrO₂)

Yttria-Stabilized Zirconia (YSZ) with exceptional fracture toughness, high impact durability and superior surface finish. Optimized for precision structural components.

Zirconia Ceramic (ZrO₂)

Zirconia Precision Components

Key Properties

Fracture Toughness: K1C >= 6.0 MPa.m1/2
Flexural Strength: 900 - 1100 MPa
Density: 6.00 - 6.05 g/cm3

Applications

Fiber optic ferrules, precision pistons, valve seats, wear-resistant shafts and bushings

Available Shapes

Rings, pins, shafts, bushings, custom geometries


Silicon Nitride Ceramic (Si₃N₄)

Conventionally sintered Silicon Nitride with superior thermal shock resistance, extreme mechanical toughness and high fatigue limits. Engineered for severe-service structural applications.

Silicon Nitride Ceramic (Si₃N₄)

Silicon Nitride Structural Parts

Key Properties

Fracture Toughness: K1C >= 5.0 MPa.m1/2
Thermal Shock Resistance: DeltaT >= 550C
Flexural Strength: 650 - 750 MPa

Applications

High-temperature ball bearings, probe card insulating plates, pick-and-place nozzles, lift pins

Available Shapes

Rings, plates, nozzles, pins, custom shapes


Silicon Carbide Ceramic (SiC)

Sintered and Reaction-Bonded Silicon Carbide with extreme microhardness, superior thermal conductivity and excellent erosion resistance. Ideal for abrasive and high-temperature environments.

Silicon Carbide Ceramic (SiC)

Silicon Carbide Wear Parts

Key Properties

Hardness: HV0.5 >= 22 GPa
Thermal Conductivity: 110 - 130 W/m.K
Elastic Modulus: 400 - 410 GPa

Applications

Wafer vacuum chucks, mechanical seal faces, focus rings, spray nozzles

Available Shapes

Plates, rings, nozzles, blocks, custom shapes


Aluminum Nitride Ceramic (AlN)

High-thermal grade Aluminum Nitride with thermal conductivity >=170 W/m.K and electrical insulation. CTE closely matches Silicon wafers for AI hardware and power electronics.

Aluminum Nitride Ceramic (AlN)

Aluminum Nitride Thermal Substrates

Key Properties

Thermal Conductivity: 170 - 190 W/m.K
Dielectric Strength: >= 15 kV/mm
CTE: 4.3 - 4.6 x10^-6/K

Applications

GPU/TPU chip carrier submounts, RF insulators, laser diode submounts, heater plates

Available Shapes

Substrates, plates, blocks, custom shapes


Boron Nitride Ceramic (BN)

Hot-Pressed Boron Nitride with outstanding thermal shock resistance, chemical inertness and self-lubrication. Optimized for vacuum furnace fixtures and molten metal handling up to 1800C.

Boron Nitride Ceramic (BN)

Boron Nitride High-Temp Components

Key Properties

Thermal Shock Resistance: Excellent
Max Service Temp: 900C air / 2000C vacuum
Dielectric Strength: >= 25 kV/mm

Applications

Vacuum furnace fixtures, crucible liners, thermocouple sheaths, spacer blocks

Available Shapes

Blocks, tubes, crucibles, custom shapes

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