Advanced Technical Ceramic Materials

Comprehensive material portfolio engineered for demanding semiconductor, aerospace, medical, and industrial applications. Direct-factory precision machining with complete material traceability and metrology validation.

±0.003 mm
Machining Tolerance
Ra 0.02
Mirror Finish
7-10 Days
Prototype Lead Time
ISO 9001
Quality Certified
100%
NDA Protection
FAI/OQC
Inspection Reports

Precision Machined Alumina Ceramic Components

Direct-factory custom machining of technical grade alumina ceramics (95% to 99.5% standard, up to 99.9% semiconductor grade available). Delivering exceptional dielectric breakdown strength and sub-micron dimensional stability.

Leveraging 10+ years of factory engineering expertise to machine dense alumina components with zero edge-chipping and minimal subsurface damage—guaranteeing the structural integrity of complex fine-pitch electrical insulators.

Key Material Properties

Hardness
HV0.5 ≥ 15 GPa
Extreme mechanical wear and abrasion resistance
Density
3.60 - 3.90 g/cm³
Highly dense structural matrix with low open porosity
Dielectric Strength
≥ 15 kV/mm
Superior volume resistivity and high-voltage insulation stability
Thermal Conductivity
25 - 30 W/m·K
Predictable heat dissipation under continuous thermo-mechanical stress
Max Service Temp
1500°C - 1600°C
Excellent structural flatness stability at elevated operating temperatures
Flexural Strength
300 - 400 MPa
Outstanding mechanical bending strength for structural components

High-Value Applications

  • Semiconductor Processing: Gas distribution plates, chamber insulating rings, isolation pins, and robot arm end effectors.
  • Electronics & Testing: High-dielectric IC testing probe card insulating backings and high-frequency power substrates.
  • Vacuum & Fluidics: High-voltage vacuum feedthrough insulators, laser cavity spacers, and severe-service chemical pump seals.

Precision Machined Zirconia Ceramic Components

Custom manufacturing of Yttria-Stabilized Zirconia (YSZ). Offering maximum fracture toughness, steel-matched thermal expansion, and supreme impact resistance.

We specialize in the precision micro-grinding and mirror-polishing of YSZ to achieve a flawless Ra 0.02 mirror surface, ensuring smooth mechanical sliding interfaces with near-zero particle generation.

Key Material Properties

Hardness
HV0.5 ≥ 12 GPa
Excellent impact resistance and low material brittleness
Density
6.00 - 6.05 g/cm³
Highly dense structural matrix with superior structural integrity
Fracture Toughness
K1C ≥ 6.0 MPa·m½
Maximum crack-propagation resistance among technical ceramics
Thermal Conductivity
2.0 - 3.0 W/m·K
Extremely low thermal conductivity acting as effective thermal barriers
Thermal Expansion
9.5 - 10.5 x10⁻⁶/K
Closely matches the Coefficient of Thermal Expansion (CTE) of engineering steel
Flexural Strength
900 - 1100 MPa
Ultra-high structural bending strength preventing mechanical fracture

High-Value Applications

  • Precision Fluidics & Dosing: Micro-liquid dispensing pump pistons, high-precision dosing cylinders, and fluid valve seats.
  • Optical Communications: High-precision fiber optic alignment ferrule sleeves, ROSA/TOSA ceramic connectors, and alignment sleeves.
  • Industrial Automation: Ceramic positioning pins, wire drawing guide rollers, customized wear-resistant shafts, and bushings.

Precision Grinding & Lapping of Silicon Carbide Components

Specialized mid-to-backend ultra-precision diamond grinding and lapping of Sintered and Reaction-Bonded SiC. Overcoming extreme material hardness to deliver high thermal conductivity and zero-warp flat surfaces.

By pairing advanced grinding machinery with strong pre-forming supply partners, we focus on delivering large-scale flat SiC components with strict flatness tolerances and excellent erosion resistance.

Key Material Properties

Hardness
HV0.5 ≥ 22 GPa
Extreme microhardness, surpassed only by diamond, optimized via expert grinding
Density
3.10 - 3.15 g/cm³
Lightweight yet ultra-rigid structural material machined to tight specs
Thermal Conductivity
110 - 130 W/m·K
Excellent thermal dissipation for high-power semiconductor environments
Elastic Modulus
400 - 410 GPa
Ultra-high rigidity and zero mechanical deformation under severe physical loads
Max Service Temp
1350°C
Maintains superior mechanical fatigue resistance in demanding industrial environments
Flexural Strength
350 - 450 MPa
Outstanding structural reliability under abrasive sliding contact

High-Value Applications

  • Semiconductor Equipment: Precision wafer vacuum chucks, electrostatic chuck base plates, wafer focus rings, and edge rings.
  • Severe Industrial Environments: Heavy-duty mechanical seal faces, chemical pump impellers, and abrasive slurry spray nozzles.
  • Advanced Automation: High-rigidity alignment blocks and dimensional guiding stages requiring near-zero thermal drift.

Precision Machined Aluminum Nitride Components

Custom manufacturing of high-thermal grade Aluminum Nitride components. Maximizing heat dissipation (≥170 W/m·K) while ensuring absolute electrical insulation and Silicon CTE matching.

Our factory provides precise dimensional controls down to ±0.003 mm for AlN substrates and components, enabling flawless thermal integration into next-gen AI hardware and GPU packaging.

Key Material Properties

Hardness
HV0.5 ≥ 10 GPa
Moderate structural hardness optimized for precision micro-features
Density
3.25 - 3.30 g/cm³
High density with zero open porosity
Thermal Conductivity
170 - 190 W/m·K
Supreme heat dissipation matching metals while remaining dielectric
Dielectric Strength
≥ 15 kV/mm
Exceptional electrical isolation at high computing frequencies
Thermal Expansion
4.3 - 4.6 x10⁻⁶/K
Perfectly matches Silicon (Si) wafer CTE to prevent packaging delamination
Flexural Strength
300 - 320 MPa
Stable mechanical reliability for high-power thermal modules

High-Value Applications

  • AI Hardware & Computing Infrastructure: High-power GPU/TPU chip carrier submounts, micro-electronic heat sinks, and thermal blocks.
  • RF Wireless & Optoelectronics: High-frequency RF wireless infrastructure insulators, laser diode submounts, and optical transceiver bases.
  • Semiconductor Wafer Processing: Precision heater plates, electrostatic chuck components, and plasma chamber insulating tabs.

Precision Machined Boron Nitride Components

Custom machining of Hot-Pressed Boron Nitride (Solid/Machinable Grade). Outstanding thermal shock resistance, zero wetness to molten metals, and clean self-lubricating properties.

We machine complex, thin-walled Boron Nitride structural components down to 0.2 mm with tight tolerances, completely avoiding material delamination or micro-fracturing in vacuum fixture designs.

Key Material Properties

Hardness
Mohs 1 - 2
Easily machineable ceramic enabling complex geometries and quick prototype iterations
Density
1.90 - 2.00 g/cm³
Highly lightweight structure with low inertia
Thermal Conductivity
30 - 50 W/m·K
Anisotropic heat dissipation depending on pressing orientation
Dielectric Strength
≥ 25 kV/mm
Extreme volumetric resistivity and insulation at elevated temperatures
Thermal Shock Resistance
Excellent
Withstands rapid temperature transitions from 1000°C to room temperature without cracking
Max Service Temp
900°C in air / 2000°C in inert high-vacuum
Ultimate high-vacuum stability

High-Value Applications

  • High-Vacuum & Sintering Technology: High-vacuum furnace insulating fixtures, thermocouple protection sheaths, and spacer blocks.
  • Molten Metal Handling: Crucible liners for high-purity metallurgy, atomization nozzles, and casting molds for non-ferrous metals.
  • Rapid Engineering Prototyping: Custom complex electrical insulators for aerospace and defense high-temperature simulation equipment.

Precision Machined Silicon Nitride Components

Direct-factory multi-axis diamond grinding of conventionally sintered Silicon Nitride components. Engineered for superior thermal shock resistance, extreme mechanical toughness, and high mechanical fatigue limits.

Our factory excels in grinding complex Si₃N₄ micro-features, thread milling, and deep slotting, completely overcoming material brittleness to deliver robust high-frequency testing components.

Key Material Properties

Hardness
HV0.5 ≥ 15 GPa
High mechanical hardness ensuring superior wear and erosion resistance
Density
3.15 - 3.20 g/cm³
Highly dense sintered matrix with excellent specific strength
Fracture Toughness
K1C ≥ 5.0 MPa·m½
Outstanding mechanical impact resistance, avoiding catastrophic structural failure
Thermal Conductivity
20 - 25 W/m·K
Optimized thermal properties preventing localized overheating
Thermal Shock Resistance
ΔT ≥ 550°C
Supreme thermal shock durability under rapid heating and cooling cycles
Flexural Strength
650 - 750 MPa
Ultra-high mechanical bending limits for highly stressed structural parts

High-Value Applications

  • Advanced Semiconductor Packaging & Testing: High-precision IC testing probe card insulating plates, high-speed pick-and-place nozzles, and wafer lift pins.
  • Severe Aerospace & Industrial Engineering: High-temperature severe-service ball bearings, locator pins, non-conductive welding rollers, and automotive sensor guides.
  • Industrial Processing & Automation: Metal forming extrusion dies, severe-service automation guides, and chemical pump wear components.

Validate Your Precision Ceramic Blueprint with KoreCera

Submit your 2D engineering blueprints or 3D CAD files (.STEP / .IGS) below. Our expert engineering team will conduct an in-depth Design-for-Manufacturability (DFM) review and deliver a competitive direct-factory quote. Fast-track prototyping completed within 7-10 business days. Full FAI, OQC, and material traceability reports provided upon delivery.

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100% Strict NDA Protection Enforced

Submit Drawing for 24-Hour Review